I believe you would be correct in saying the component terminations are

exempt also, whether you will still be able to get SnPb terminations

throughout will be another matter.



Regards,

Chris



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Tracey

Christiansen

Sent: 18 November 2004 18:06

To: [log in to unmask]

Subject: [LF] Lead in electrical component finishes



I need help with an interpretation of exemption Number 7 in the ROHS

annex

regarding servers.



The exemption reads:

"- lead in solders for servers, storage and storage array systems

(exemption

granted until 2010)"



The annex does not just say "lead" -- it says "lead in solders".

Therefore,

there is an opinion that only lead used in solder is considered exempt

(until 2010).  Lead used elsewhere (such as in component finishes) is

not

exempt.



I have read a DTI guidance document - July 2004 that suggests that

solder is

defined as "alloys used to create metallurgical bonds between two or

more

metal surfaces to achieve an electrical or physical connection."  The

same

document also states that their interpretation is that the exemption

applies

to the whole of the finished device to include components (where

metallurgical bonds are created).  With this in mind, we have now formed

a

different opinion that component finishes can fall within the exemption.



Would anyone on this forum like to offer an opinion on which

interpretation

is compliant with the exemption?



Thanks for your consideration of my dilemma,



Tracey C





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