Dear Forumees

Does anyone have any reliability data you might share (or a reference)
comparing Pb-free BGAs soldered with SnPb in the cases where

i)  the BGA ball is completely reflowed, and
ii) where the ball is not completely reflowed and so grades in composition
from top to bottom.

Thanks in advance...

Jim

James H Vincent
Lead Engineer, Reliability Engineering
Bookham, Caswell
+44 (0)1327 356318



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