Dear All
ERA is currently concluding a study for the EC TAC committee on RoHS
exemptions. The scope is given in http://www.era.co.uk/news/pr0412.asp. The
study includes flip chips. We have already presented some findings to the
TAC and their hope is to be able to vote on most of these at their meeting
in December. We will cover this in our occasional newsletter "RFA News"
(http://www.era.co.uk/news/rfa_news.asp to which you can subscribe free
online if you wish) and the DTI will publish informal minutes of the
meeting-hopefully before Christmas on
http://www.dti.gov.uk/sustainability/weee/index.htm#Latest_EU_developments
I hope this is of some help
Regards
Chris
Dr Chris Robertson
Reliability and Failure Analysis, ERA Technology Ltd
Cleeve Road, Leatherhead, Surrey KT22 7SA, UK
http://www.era.co.uk/rfa.htm
Tel: +44 (0)1372 36 7204
Fax: +44 (0)1372 36 7134
<><
PS Batteries are not covered by RoHS (see the Batteries Directive) but WEEE
requires removal before shredding
-----Original Message-----
From: Leo B. Buya [mailto:[log in to unmask]]
Sent: 09 November 2004 00:23
Subject: Re: flipchips inside sealed containers
Seems that I don't receive any news today. What has happened?
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]
Sent: Saturday, November 06, 2004 6:13 AM
To: [log in to unmask]
Subject: Re: [LF] flipchips inside sealed containers
There is a move under way to consider flip chip for exemption status - I am
not sure how far it got, at the present time the flip chip termination will
be counted as a percentage of the component total content, the fact that it
is sealed in will not exempt it.
On your second point, I doubt it, you could ask the question the other way
around "are ram enhanced battreries non-exempt??". Maybe someone on the list
could answer this second point.......hmmmmmmmmmm if the battery were a 1501
volt device .........then IT WOULD BE EXEMPT...well it is Friday - at least
in California.........8-)
John
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of to Paul Taylor
Sent: Friday, November 05, 2004 4:55 AM
To: [log in to unmask]
Subject: [LF] flipchips inside sealed containers
Hi all
I was wondering is any other of the listservers had any views on the
following questions:
Does lead free apply to types of devices if they are sealed. This would
be for example devices that have flip-chips with high-lead bumped solder
constructed inside a self-contained package assembly.
As batteries are exempt, does that mean battery backed RAM devices are
exempt?
regards
Paul
Paul R Taylor
Senior Engineer, Product Supply Group
tel: +44 1279 449 744
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