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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Tue, 9 Nov 2004 14:48:03 -0600 |
Content-Type: | text/plain |
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Hi All,
Does anyone have any data on the following items;
1. DOEs (and results) for LF (sac) reflow profiles? Variations in ramp,
soak, peek, cool and nitrogen environment?
2. Effect of LF paste on self centering devices (BGAs)?
Any feedback and info would be greatly appreciated!
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Carl Ray
Manufacturing Engineering Manager
Plant 520 (Kenosha Operations)
Pleasant Prairie, WI 53158
Desk: 262-947-2730
Fax: TBD
Cell: 262-620-3966
[log in to unmask]
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