Ofer:
The connector guy (maybe this was me?) may not have disclosed the lead
content because the lead levels in copper alloys added for machinability are
all below the exemption levels in RoHS and ELV. Presumably, this is why the
limit was set at that level. The level can be disclosed, but since it is
exempt this may just be extra work that adds little value. If you have to
know, go back to your source.
Of your second list, TBBPA is a common flame retardant, especially in
printed circuit boards. It is not banned by any legislation, though it must
be reported, tracked and separately handled as per WEEE since it is a
brominated flame retardant.
Cheers,
Bob Hilty
Tyco Electronics
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Ofer Cohen
Sent: Tuesday, November 09, 2004 8:34 AM
To: [log in to unmask]
Subject: Re: [LF] Flame retarder compliance on 2006
Hello all,
Some RoHS questions:
1. A connector data sheet, from a well known manufacture, includes the
following statement: "lead can be used as an alloying additive to
copper, hence the connector is RoHS compliant". No ratio of the lead in
the alloy is given. Does this sound strange only to me?
2. A customer sent me the following list:
Tetrabromobisphenol-A (TBBA)
Triphenyl phosphates
Polychlorinated compounds:-
Polychlorinated biphenyls (PCBs) (CAS: 1336-36-3)
Polychlorinated terphenyls (PCTs) (CAS: 61788-33-8)
Polychlorinated Naphthalenes (PCNs)
Halons Bromofluorochlorocarbons :-
Halon 1211 (CAS: 353-59-3)
Halon 1301 (CAS: 75-63-8)
Halon 2402 (CAS: 124-73-2)
Any idea if these materials are being used in electronic assembly and
where?
May be I am over-sensitive, after receiving a statement from a PBGA
vendor: "as there is no lead in the component the component is
lead-reduced (apart of the balls)". Nice little last word.
Regards
Ofer Cohen
Manager - Quality, Reliability and Production Technologies
Seabridge - a Siemens company
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