Hi Gai-T Blair, IPC LF Listservers,

Nah! you aren't confused, yet I like the strategy.


> I'm confused (again), but that's not unusual.
>
> I seem to remember a thread a while back (checked the archives - found a
> post by David Suraski on 5/31/2001) that indicated that use of components with a
> lead finish containing lead would harm the reliability of solder joints of
> lead free solder. It was my understanding from this that the small amounts of
> lead from the lead finish dissolving into the LF solder joint caused the
> solder joint to be unreliable. However, more recent posts indicated otherwise.

I won't go back and read AIM DavidS's note yet from what I have seen from
micrographs lead (Pb) will create a region in the joint structure that can be a
metalurgical region for localized failure. ("Slip slidding away") This will all
depend on the local situation and the long term usage conditions or the
reliability tests that are used to judge long term reliability.

Yours in Engineering, Dave
Y i Engr, MA/NY DDave

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------