Hello all,
Some RoHS questions:
1. A connector data sheet, from a well known manufacture, includes the
following statement: "lead can be used as an alloying additive to
copper, hence the connector is RoHS compliant". No ratio of the lead in
the alloy is given. Does this sound strange only to me? 

2. A customer sent me the following list:
        Tetrabromobisphenol-A (TBBA) 
        Triphenyl phosphates 
        Polychlorinated compounds:-
                Polychlorinated biphenyls (PCBs) (CAS: 1336-36-3)
                Polychlorinated terphenyls (PCTs) (CAS: 61788-33-8)
                Polychlorinated Naphthalenes (PCNs)
        Halons Bromofluorochlorocarbons :-
                Halon 1211 (CAS: 353-59-3)
                Halon 1301 (CAS: 75-63-8)
                Halon 2402 (CAS: 124-73-2)
Any idea if these materials are being used in electronic assembly and
where?

May be I am over-sensitive, after receiving a statement from a PBGA
vendor: "as there is no lead in the component the component is
lead-reduced (apart of the balls)". Nice little last word.

Regards
Ofer Cohen
Manager - Quality, Reliability and Production Technologies
Seabridge - a Siemens company

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