LEADFREE Archives

November 2004

Leadfree@IPC.ORG

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 5 Nov 2004 14:13:18 -0800
Content-Type:
text/plain
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text/plain (64 lines)
There is a move under way to consider flip chip for exemption status - I am
not sure how far it got, at the present time the flip chip termination will
be counted as a percentage of the component total content, the fact that it
is sealed in will not exempt it.

On your second point, I doubt it, you could ask the question the other way
around "are ram enhanced battreries non-exempt??". Maybe someone on the list
could answer this second point.......hmmmmmmmmmm if the battery were a 1501
volt device .........then IT WOULD BE EXEMPT...well it is Friday - at least
in California.........8-)

John



-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of to Paul Taylor
Sent: Friday, November 05, 2004 4:55 AM
To: [log in to unmask]
Subject: [LF] flipchips inside sealed containers


Hi all

I was wondering is any other of the listservers had any views on the
following questions:

   Does lead free apply to types of devices if they are sealed.  This would
   be for example devices that have flip-chips with high-lead bumped solder
   constructed inside a self-contained package assembly.

   As batteries are exempt, does that mean battery backed RAM devices are
   exempt?

regards
Paul

Paul R Taylor
Senior Engineer, Product Supply Group

tel: +44 1279 449 744

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