LEADFREE Archives

November 2004

Leadfree@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
flipchips inside sealed containers
From:
to Paul Taylor <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 5 Nov 2004 12:55:03 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines) 
Hi all

I was wondering is any other of the listservers had any views on the
following questions:

   Does lead free apply to types of devices if they are sealed.  This would
   be for example devices that have flip-chips with high-lead bumped solder
   constructed inside a self-contained package assembly.

   As batteries are exempt, does that mean battery backed RAM devices are
   exempt?

regards
Paul

Paul R Taylor
Senior Engineer, Product Supply Group

tel: +44 1279 449 744

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
email: [log in to unmask]

ATOM RSS1 RSS2