Hi Dacia, IPC LF Listservers,

Firstly,
I agree with what AIM's DavidS wrote, since long before DavidS has shown
his experience to us in the Boston area, I have seen similar
microstructures of metal or phase separation that fit the same pattern.
Metals Handbooks by ASM are also a good resource as is the ASM society.

Will it fail, when-what-where, I will leave to my/our failure gurus like
Werner our man Englemair, and Guenter, NPL too,

<Another question:
From my research, I have gathered that current PCBs used for the standard
tin/lead process may or may not be acceptable for lead free processing.
Items to consider when evaluating whether or not these boards are acceptable
for use include board complexity, rework potential, single vs. double sided,
etc.  The only way to determine acceptability is through process evaluation.
Is this a correct assumption?  Or am I way off the mark here?

YES, you are right.

It all depends on the thermal effects you will reach in the soldering
process and the withstand effects of the materials.

Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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