Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 1 Nov 2004 13:25:47 EST |
Content-Type: | text/plain |
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Hi Linda, IPC LF Listservers,
Linda, Thanks a lot, for your note.
> Dave,
> I have been experimenting with the hand soldering processes at our company.
> I found that 96.5Sn 3.0 Ag, 0.5Cu wire solder acts like a drop in
> replacement for the old solder. The solder joint looks a little different (duller)but
> the assemblers can identify it as a good solder joint right away. The solder
> joints flow and wet the same.
>
Does the wire solder you are using come with flux added or do you add flux
with a small bottle? In terms of ease of hand soldering do you know if what you
are experimenting with are the easy joints. (small lands, small components,
thin structures, fresh i.e. non aged metalurgies). And when you go to heavier
components, reasonable internal ground planes or a bit more aged leads or lands
what your comparison's have yielded.
Since quite often a dull joint doesn't pass some of the visual hand soldering
quality guides, have you settled in on another set of quality guides for your
operators or inspectors. BTW as an aside, I believe are Listserver friend
Cousin UK-Bobbie Willis of the England-SMART group has supplied some visual
aides, even into the IPC
Yours in Engineering, Dave
YiEngr, MA/NY DDave
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