I normally answer question on TechNet, but now I have a question:
What is the best IPC standard solderability test for ENIG finish on a pcb?
We have a customer that is testing the ENIG solderability of BGA lands on
one of their cards by screening solder paste about 0.004" thick (I think
this is 1/2 their normal thickness) and then reflowing as normal. These
are blank cards-no components on them and they are looking for complete
wetting over all the BGA lands.
Happy Holden
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