Hi Tom,

In my interpretation such balls are not process indicators but defects.

The fact that these balls don't become dislodged during washing doesn't
mean that they will keep being adhered to the board when the product is
submitted to shocks or vibrations.  But is depends on the service
condition of the product.



Best regards,

Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems

Tel        +31(0)35 524 8297
Fax       +31(0)35 524 8181
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>>> [log in to unmask] 10/08/04 04:35pm >>>
Dear Group,
I'm asking the group again to impart your communal wisdom in
interpreting
IPC-A-610. We are seeing solder balls on our SMT assemblies after they
have
gone thru board wash (dishwasher). Would these be classified as
entrapped/encapsulated and therefore process indicators and not
subject
to "rework" (as long as they don't violate minimum electrical
clearance)?
Thanks.

Tom Moore

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