may be centrifuge clean?
http://www.flipchips.com/update08.html

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Precision Lab
Sent: Friday, October 08, 2004 10:54 AM
To: [log in to unmask]
Subject: Re: [TN] Soldering .8mm BGAs


Hello Al,
>
One quick thought I had with regard to your cleaning question is that
although OA materials are usually water soluble, it might be that with a
low stand-off part such as a BGA that the surface tension of water
(approx. 73 dyne) may be to high to reach underneath the part.  Straight
DI water wash may not be effective enough. One option might be to add a
bit of saponifier to the wash.  Many saponifiers help to reduce the water
surface tension and can aid the process for more effective cleaning
underneath components. My two cents!

Joe Russeau
Process Analyst

Precision Analytical Laboratory




Hello Technetters:
>
> Processing a 16"x20", .125" thick double-side mixed-tech (smt both sides,
> and pth component side) with at least two .8mm BGAs with .45mm balls:
>
> one is a 84 pin package is a 9 x 15 - 135 - ball matrix with 51
> depopulated balls in the center of the package
> the other is a 8 x 12 - 96 ball - matrix with 8 depopulated balls - 4 at
> either end of the matrix
>
>
> Two quick questions:
>
> Can I clean (in-line) using di water only if I use OA flux?  Or, do I need
> to switch to no-clean for BGAs less than 1mm?
> For rework, flux only?  Or can I micro-stencil or dispense?
>
>
> As always, thanks in advance for your replies,
>
>
> Al Kreplick
> Sr. Mfg. Eng.
> Teradyne, Inc.
> 500 Riverpark Drive
> Mail Stop NR500 1-1
> North Reading, MA 01864
> Tel: 978-370-1726
> Pager: 888-561-6485
>
>
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