Also, what's the percent metallization?  More metal area means greater
difficulty in getting moisture to egress (needs to diffuse to edge of metal
first).

dw

At 03:02 PM 10/6/2004 -0500, Paulus, Jim wrote:
>As is frequently found in technet replies: it depends.
>Is your board made with adhesiveless flex?  Or Acrylic?
>What happens after the bake? And how long after?
>Does the flex have coverlay? What?
>jimpaulus
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Larry Koens
>Sent: Wednesday, October 06, 2004 2:14 PM
>To: [log in to unmask]
>Subject: [TN] Rigid flexs and moisture
>
>Technetters,
>Is there any type of  published guidelines at what temperature and for
>how long you should prebake Rigid flex PCBs? My board is a FR4 with a
>Kapton layer in the middle.
>thanks,
>Larry Koens
>
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