If I am the operator, I'll put it in class 1000 room. If you required good
cpk, I'll put it in class 1000 room. If you are in R&D to do proove of
concept only, well, anything goes as long as it sticks well and meet the
mil-spec/jedec min. requirements (no reliability concern).
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Creswick, Steven
Sent: Monday, October 04, 2004 10:38 AM
To: [log in to unmask]
Subject: Re: [TN] Wire bonding equipment
Hilbrand,
I have experienced the gamut of wire bonders sitting out in a plant
environment, to wire bonders sitting in a clean room.
To some extent it goes back to what type of reliability your product
requires, and the type of line you may be setting up.
Granted, I am not in favor of wire bonders out in the 'plant'
environment....there is just way too much dirt and yuck that accumulates on
that fine piece of precision equipment! But you could place a 'bubble' over
the wire bonder alone, and leave the rest of the equipment 'outside'. As
long as the bubble is pressurized somewhat [HEPA filter], it tends to keep
the debris out.
My personal perspective is that if a wire bonder is 'out on the floor', that
people treat it as though it were something simple like a 'chip shooter'. I
find it better to keep something with 100-1000X the accuracy of a generic
'chip shooter' away from the hands of the curious, those with a brute force
attitude, those that say, 'I have no training, but I can fix it anyway' -
misguided, but well intentioned individuals ....
Just as a friendly suggestion, if this is your first experience with wire
bonding, you have far more to learn about then just what environment to
place it in. :-)
You may consult your proposed wire bonder manufacturers to see how they
would feel about their equipment being placed into your various
environmental scenarios, and adjust your plans accordingly.
Food for thought..
Steve Creswick
-----Original Message-----
From: H. Molema [mailto:[log in to unmask]]
Sent: Monday, October 04, 2004 5:00 AM
To: [log in to unmask]
Subject: [TN] Wire bonding equipment
Hi,
I am looking for information about the equipment and the surroundings "clean
room?" that you need for wire bonding on a pcb.
Are there people on the Tech-net who are willing to share their experience
with wire bonding.
I did find a link that was very useful for general information
http://extra.ivf.se/ngl/A-WireBonding/ChapterA.htm
Thanks,
Hilbrand.
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