Hi All,

I'm a board designer and I'm looking for as much info
as I can find about the
differences/methods/similarities to IR reflow,
wave-solder, convection et al.

What can I do at the design stage to make things
easier?

Is the method used figured out AFTER the board gets to
you for assembly?

What board finishes give the least headaches?

I'm thinking of component orientation and I'd be glad
to listen to anything that I could do to smooth things
out.

(I never did like the chuck it over the wall method of
sending a board to fab and assembly).

Regards,

Bob Wilson
www.cstone-design.com

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