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October 2004

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Subject:
From:
Glenn Pelkey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 29 Oct 2004 09:26:16 -0700
Content-Type:
text/plain
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text/plain (103 lines)
Hi Steve,

It would be Copper with Nickel and Gold as the final surface finish.

Thanks,

Glenn

-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]]
Sent: Friday, October 29, 2004 9:15 AM
To: 'TechNet E-Mail Forum'; Pelkey, Glenn R
Subject: RE: [TN] Edge Plating Criteria


Hi Glenn,
Are you talking copper plating, gold over copper - what kind of plating?
Regards Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glenn Pelkey
Sent: Friday, October 29, 2004 11:23 AM
To: [log in to unmask]
Subject: Re: [TN] Edge Plating Criteria

I should have been clearer.  Some boards have a routed edge, either an
internal cavity or external perimeter, that requires plating from the top to
bottom layers.  Sometimes, there are application specific features that are
critical, but I'm wondering if there is a general acceptance criteria.

Thanks,

Glenn
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, October 29, 2004 8:15 AM
To: TechNet E-Mail Forum; Pelkey, Glenn R
Subject: Re: [TN] Edge Plating Criteria



Glenn,

What do you mean by "Edge Plating"?  Are you referring to plating thickness
at the edge of an interconnect substrate vs. plating thickness elsewhere?

RM


-------------- Original message from Glenn Pelkey
<[log in to unmask]>: --------------


> Hi Technetters,
>
> Anyone know if "Edge Plating" criteria is called out in any of the
> inspection standards?
>
> Thanks,
>
> Glenn
>
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