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October 2004

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Sat, 2 Oct 2004 01:47:21 +0100
Content-Type:
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You can use the latest version of Vapour Phase referred to as Condensation
soldering - works great.
--
Regards Graham Naisbitt

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Concoat Limited - Engineering Reliability in Electronics
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> We tried this with a piece of Rogers4003 on top of FR4.  The surfaces being
> soldered together were almost solid ground plane, so we had a checkerboard
> pattern of soldermask/solderpaste, in order to help it line up when the
> solder reflowed.  I think the assemblers also put a piece of buss wire
> through two lined up vias on each board, before running it through the oven,
> to keep the boards from sliding around.
> I think it worked OK, but it was several years ago and the product never
> took off so it wasn't a high volume run.
>
> -----Original Message-----
> From: Phil Nutting [mailto:[log in to unmask]]
> Sent: October 1, 2004 7:24 AM
> To: [log in to unmask]
> Subject: [TN] stacking PC boards and reflowing together
>
>
> Good morning,
>
> Has anyone tried reflow soldering one circuit board on top of another as if
> the top board were just another SMT part?
>
> We have a design where we currently design this as thru-hole boards and
> attempt to solder them together... sometimes three boards high, which never
> works to my satisfaction.
>
> Phil Nutting
> Manufacturing Engineer
> Kaiser Systems, Inc.
> 126 Sohier Road
> Beverly, MA 01915
> voice 978-922-9300, ext. 2315
> fax 978-977-3018
> e-mail [log in to unmask]
> www.kaisersystems.com
>
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