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October 2004

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Fri, 29 Oct 2004 08:21:48 +0200
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text/plain
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text/plain (110 lines)
It's a hole in your bucket dear Reuven.....
Belafonte didn't know at that time about copper plugging.
Cu plugged vias will increase heat transportation dramatically.
We do it on some boards when required. Can give you name
offline if you are interested...

Ingemar Hernefjord
Ericsson Microwave Systems


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Reuven ROKAH
Sent: den 28 oktober 2004 14:19
To: [log in to unmask]
Subject: Re: [TN] IC's with solderable area underneath


Its should be soldered by reflow oven or reflow of rework station (the same
as for BGAs components).

The PCB should be designed with special via holes size for heat transfer
(the diameter should be controlled for not sucking the melted solder
paste).


Best  Regards

Reuven  ROKAH

e mail: [log in to unmask]



                      Daan Terstegge
                      <[log in to unmask]         To:      [log in to unmask]
                      SGROUP.COM>                      cc:
                      Sent by: TechNet                 Subject: [TN] IC's with solderable area underneath
                      <[log in to unmask]>


                      28/10/2004 13:52
                      Please respond to
                      TechNet E-Mail Forum;
                      Please respond to Daan
                      Terstegge





Hi Technet,

I'm seeing more and more QFP's and other IC's with a solderable area
underneath the package body (heatsink function). Strangely enough not
much thought is being given to expectations of designers or to the
problems that these components may give in assembly.
Does anyone know of standard requirements (i.e. IPC) for the soldered
area?   When a designer doesn't mention it on the assembly drawing,
would you assume that is still mandatory to have solder in that area? If
so, how can this requirement be met when using a soldering iron (i.e.
Metcal's minihoof tip) to install a QFP for rework or repair?
Any other comments with regards to such components?



Best regards,

Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems

Tel        +31(0)35 524 8297
Fax       +31(0)35 524 8181
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