That's the next step. One's already been ordered. Kapton stencil.
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)310-7588 cell
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tom Carroll
Sent: Wednesday, October 27, 2004 9:49 AM
To: [log in to unmask]
Subject: Re: [TN] Question about 2% Ag and stencil release
Jason
A different slant on your problem.
Have you considered changing to a 0.005" thick stencil?
Best Regards
Tom Carroll
Tel +44 [0]1786 450572 Ext 227 (Office)
Fax +44 [0]1786 474653
GSM +44 [0]7747 895854
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> -----Original Message-----
> From: Jason Gregory [mailto:[log in to unmask]]
> Sent: Wednesday, October 27, 2004 2:08 PM
> To: [log in to unmask]
> Subject: Re: [TN] Question about 2% Ag and stencil release
>
> Yes, same flux in both pastes
>
>
>
> Jason Gregory
> Manufacturing Engineer
> Innova Electronics
> (281)653-5593
> (281)653-5594 fax
> (281)310-7588 cell
> [log in to unmask]
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Taheri, Kamran
> Sent: Tuesday, October 26, 2004 7:39 PM
> To: [log in to unmask]
> Subject: Re: [TN] Question about 2% Ag and stencil release
>
>
> Jason, did both solder pastes have the same flux chemistry?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Daan Terstegge
> Sent: Tuesday, October 26, 2004 4:00 PM
> To: [log in to unmask]
> Subject: Re: [TN] Question about 2% Ag and stencil release
>
>
> Hi Jason,
>
> I don't believe this has anything to do with silver.
> The fine powder of your type 5 paste has a MUCH larger ratio
> between soldersurface and soldervolume than the part 3 type,
> which means that it is more difficult to keep the powder
> particles stable and oxide-free. The smaller process window
> increases the chance of printing problems.
> Hopefully a more accurate description will be given by one of
> the paste manufacturers on this forum, but I think I'm pretty
> close....
>
> Best regards,
>
> Daan
> http://www.smtinfo.net
>
> ----- Original Message -----
> From: "Jason Gregory" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, October 26, 2004 9:44 PM
> Subject: [TN] Question about 2% Ag and stencil release
>
>
> > Has anybody had any experience or seen/written studies
> involving 2% Ag
> > release from stencil apertures? We have a stencil, parts are small
> resnets,
> > about 15 mil pitch on a .006" thick stencil. Tried 2% silver paste
> > (for tombstoning of other parts) with type 5 powder and had major
> > release problems. We kept the same parameters on the screen
> printer
> > (for reference/control purposes) and swapped in our "normal" 63/37
> > Type 3
> powder
> > and release issues "virtually" went away. Not all the way,
> but for the
> most
> > part. I thought smaller mesh should have meant better
> release. Solder
> > gurus ------- enlighten me!
> >
> > Jason Gregory
> > Manufacturing Engineer
> > Innova Electronics
> > (281)653-5593
> > (281)653-5594 fax
> > (281)310-7588 cell
> > [log in to unmask]
> >
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