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October 2004

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Wed, 27 Oct 2004 07:27:55 -0700
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Ken,

Yes, there most definitely is a concern.  The wt% gold must be kept below ~
3 wt% or the volume fraction of AuSn4 will be too high in the joint causing
gold embrittlement.

Ed Hare
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
Sent: Wednesday, October 27, 2004 6:53 AM
To: [log in to unmask]
Subject: [TN] Gold Board


Good morning TechNetters (at least here on the left coast),

We have a small assembly that requires a couple of pads to be gold plated.
We would like to gold plate the entire board but we're concerned about gold
embrittlement when we solder the components in. The board is completely
through hole and will be both wave soldered and hand soldered.

Do you think we have any concerns? Oh by the way this is a class 3 assembly.

Thanks,

KennyB

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