Smaller vias produce less inductance making low inductance bypass caps
more effective of low inductance no longer needed.  The resin fill is a
normal function of the sub-assembly build up technique for blind vias. 




Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	


-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]] 
Sent: Tuesday, October 26, 2004 3:22 PM
To: [log in to unmask]
Subject: [TN] Filled vias

Good day to all,

We have a customer who wants us to fill some blind vias with pre-preg.
First I have not heard of a pre-preg fill product. Second the via to be
filled will be .003 - .004 . Third - the customer is under the
impression this will improve electrical performance- is this true? Any
thoughts or help would be appreciated. Thanks in advance. Steve Kelly

 

PFC Flexible Circuits Limited

Ph: (416) 750-8433

Fax: (416) 750-0016

Cell: (416) 577-8433

E-Mail: [log in to unmask]

 


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