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October 2004

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Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee Parker <[log in to unmask]>
Date:
Tue, 26 Oct 2004 22:32:09 -0400
Content-Type:
text/plain
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Steve

There are several products on the market that have properties similar to
prepreg that are designed for via filling and could conceivably be used
for this application. Often the designer fills the via and then uses the
same pad for the BGA attachment site (after overplating) and reduces the
path length to the second layer which is often a ground. Reducing the
path length obviously improves the electrical performance.

Best regards

Lee

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Tuesday, October 26, 2004 3:22 PM
To: [log in to unmask]
Subject: [TN] Filled vias

Good day to all,

We have a customer who wants us to fill some blind vias with pre-preg.
First
I have not heard of a pre-preg fill product. Second the via to be filled
will be .003 - .004 . Third - the customer is under the impression this
will
improve electrical performance- is this true? Any thoughts or help would
be
appreciated. Thanks in advance. Steve Kelly



PFC Flexible Circuits Limited

Ph: (416) 750-8433

Fax: (416) 750-0016

Cell: (416) 577-8433

E-Mail: [log in to unmask]




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