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October 2004

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Thu, 21 Oct 2004 16:04:50 +0100
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Jason

The British NPL produced a useful "Good Practice Guide for Thermal
Profiling" that you could access via:
http://www.npl.co.uk/ei/related/downloads.html

I also have a similar report and if you would like a copy then do please ask
offline
--
Regards Graham Naisbitt

[log in to unmask]

Concoat Limited - Engineering Reliability in Electronics
A British Manufacturer

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> From: Jason Gregory <[log in to unmask]>
> Reply-To: TechNet E-Mail Forum <[log in to unmask]>, Jason Gregory
> <[log in to unmask]>
> Date: Thu, 21 Oct 2004 09:37:18 -0500
> To: <[log in to unmask]>
> Subject: [TN] A poll of sorts...concerning thermocouple attachment
>
> What is everyone's (anyone's?) preferred method of thermocouple attachment?
> Does anyone prefer soldered wires over aluminum tape? Or Temprobes over
> epoxy? Also, is there any spec versus rule-of-thumb about alloys to use to
> profile PCBs? Is there any concensus that SN96 is best to use when profiling
> SN63 boards? Or HMP to use when profiling SN96 boards? There obviously is
> need when soldering probes to go over the liquidus of the PCB you are
> attaching to, but by how much?
>
> Any replies appreciated.
>
>
>
> Jason Gregory
> Manufacturing Engineer
> Innova Electronics
> (281)653-5593
> (281)653-5594 fax
> (281)310-7588 cell
> [log in to unmask]
>
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