TECHNET Archives

October 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jason Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jason Gregory <[log in to unmask]>
Date:
Thu, 21 Oct 2004 09:37:18 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
What is everyone's (anyone's?) preferred method of thermocouple attachment?
Does anyone prefer soldered wires over aluminum tape? Or Temprobes over
epoxy? Also, is there any spec versus rule-of-thumb about alloys to use to
profile PCBs? Is there any concensus that SN96 is best to use when profiling
SN63 boards? Or HMP to use when profiling SN96 boards? There obviously is
need when soldering probes to go over the liquidus of the PCB you are
attaching to, but by how much?

Any replies appreciated.



Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)310-7588 cell
[log in to unmask]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2