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| Date: | Thu, 21 Oct 2004 08:52:25 -0400 |
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IPC-A-610C and found the following pertaining to solder balls. Para 6.5.3.1 and Para 12.4.10 Entrapped or encapsulated solder balls that are within 0.005 inch of lands or conductors, or exceed 0.0051 inch in diameter . Target condition is no evidence of solder balls on the printed wiring assembly
Acceptable condition Class 1
Process Indicator Class2,3.
Tom Gervascio
Senior Process Engineer
Sparton Electronics
(352) 540-4040
>>> [log in to unmask] 10/20/04 10:26PM >>>
Hi all
I was wonder if anyone had come across a situation where the adhesive
under the surface mount components had flux residue trapped which was
than attacking the soldermask and copper underneath.
Also saw some very small solderballs.
Any idea what would be the cause and how to avoid this ?
Thanking you
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Friday, October 15, 2004 10:32 AM
To: [log in to unmask]
Subject: [TN] Solderball Trapped in Flux Residues
Hi All!
Yesterday, Bill Kenyon sent me a very good picture of a solderball
trapped in
flux residue that I finally got posted this morning on my web page at:
http:www.stevezeva.homestead.com
-Steve Gregory-
Steve- would you please post this photo on your web site? It's an
excellent
microphoto of a solder ball on solder mask, showing the flux residue
holding it
in place. Just washing with water won't do the job, unless it completely
dissolves the flux residue.
Ref.: An Evaluation of Solder Balls on Printed Wiring Boards with Dry
Film
Solder Resist, Mira Khutoretsky, Control Data Corp. Electronic Packaging
&
Corrosion in Microelectronics, pp 225-233, 1987(published by ASM)
Bill Kenyon
Global Centre Consulting
3336 Birmingham Drive
Fort Collins, CO 80526
Tel: 970.207.9586 New Cell: 970.980.6373
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