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October 2004

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Thu, 21 Oct 2004 11:59:26 +0200
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Hi Steve! Wow, ya never would have thought a simple picture of a very beat
up LCC would be so interesting!

Dave


Hi Dave,
happened to get old article from APL on desk 'Reflow attachment and reliability testing of ceramic chip carriers'.  And another from Bell Labs. According to these, the packages were not so bad (at that time). Quoted:

'The general implications are that minor cracking occurs in the solder joints during tempcycling, but to date no adverse effects have been seen.....
...........from the study it appears that chip carriers provide a highly reliable, easily testable, and easy to assemble packaging technique....'

'...the solder joints withstood 1,000 cycles -40/+130 Centigrades and aging at as high as +175 Centigrades.........the failure rate at +80 C is projected to be negligible for fifty years....'


Myself, was involved in development of a computer, whereas each board had some 100 LLCCs, built on multiceramic and copper technology. Think I have some pics still from that interesting time about 20 years ago...

Ingemar Hernefjord
Ericsson Microwave Systems

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