Jedec spec are free, you need to register on the jedec site: www.jedec.org
jk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Wednesday, October 20, 2004 10:12 AM
To: [log in to unmask]
Subject: Re: [TN] BGA ball-to-package failures
Werner,
I was able to locate the following IPC standards redrading the above
stated failure mode.
IPC-9702 "Monotonic Bend Test Method for Surface Mount Solder
Attachments"
IPC-9701 "Performance Test Methods and Qualification
Requirements for Surface Mount Solder Attachments"
However, I was not able to locate JESD22-B117
Can you please provide a path to this publication?
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Monday, October 18, 2004 3:49 PM
To: [log in to unmask]
Subject: Re: [TN] BGA ball-to-package failures
Hi Tom,
As you recognized, this is bad quality, and thus not subject to any
modeling
or prediction capability.
1)Develop or identify some sort of standard physical test (shear or
tensile)
to measure the as-shipped or as-received strength of the ball-to-package
joint, probably room temperature, maybe at an elevated temperature.
We are way ahead of you on this; take alook at:
IPC/JEDEC-9702 "Monotonic Bend Test Method for Surface Mount Solder
Attachments" and upcoming
IPC-9703 "Shock Test Methods and Qualification Requirements for Surface
Mount
Solder Attachments;" these standards address the issues of "brittle"
failure
and waek metallizations. IPC-9701 "Performance Test Methods and
Qualification
Requirements for Surface Mount Solder Attachments" deals with the
reliability
expectations of good solder joints on the various components.
2)Start gathering a data base, linking mean and variability to material
and
process.
Unfortunately, that may not be particularly helpful, since these kind of
'defective' attachment metallizations are 'defective' on a sporadic
basis without
much in terms of 'predictors,' and when they occur they are typically
catastrophic.
3)Start relating this relative ball-to-package strength data to maverick
failures at the interface, in t-cycle testing.
See 2)
4)Depending on results, and if these failures persist in mil/aero
applications, consider adding a suitable qualification and
lot-acceptance test and
criteria to incoming BGAs.
See 1)
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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