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October 2004

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Subject:
From:
Joyce Koo <[log in to unmask]>
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Date:
Fri, 15 Oct 2004 14:50:34 -0400
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phil,
dream on phil.  it just start come back big time.  Check qfn (jedec MO
220)...

                                   jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Crepeau, Phil
Sent: Friday, October 15, 2004 2:30 PM
To: [log in to unmask]
Subject: Re: [TN] LCC process and manufacturing recommendations


hi,

i thought these puppies died some time ago.  solder joint cracking is
dependent on, among other things, the physical size of the package.  the
greater the diagonal length the greater the chance of solder joint cracking.
you should discourage the use of these packages.  if the customer insists on
using them, they should put leads on them which isn't all that difficult.

otherwise you need to go to substates that come close to matching the cte of
ceramic (like a kevlar reinforced laminate).  an additional help would be to
add dry film bumps under the lccs to keep them from settling down onto the
pwb.

phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of
[log in to unmask]
Sent: Friday, October 15, 2004 10:52 AM
To: [log in to unmask]
Subject: [TN] LCC process and manufacturing recommendations


Fellow technetters,

I taught of using Technet's pool of knowledge to get some recommendations on
LCC type devices. We have a customer asking questions on this package, and
all I know is that there are concerns of solder joint cracking due to
board/ceramic CTE mismatch.

What are the pros and cons of LCC devices?
Process and manufacturing recommendations?
Solder joint reliability?
Reliability under extreme environment conditions?

Any comment would be greatly appreciated.

Thanks!

Jorge A Rodriguez
Sr. Process Engineer
Varian, Inc
480-968-6790 X 4258
[log in to unmask]


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