TECHNET Archives

October 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Le Ai Quoc <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Le Ai Quoc <[log in to unmask]>
Date:
Thu, 14 Oct 2004 10:31:32 +0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Hi Technetters,
Do you know the opening style (aperture) for stencil (metal mask) applied
for printing solder paste on resistance, capacitor chip 0603mmm to prevent
"Tombstone/Manhattan" after reflow. Also, pls. advise about stencil
thickness.
Last but not least, is the reflow profile important for this defect? Any
suggestion?
Thanks in advance,
Le Ai Quoc

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2