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| Date: | Mon, 11 Oct 2004 08:56:14 +0200 |
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Interesting topic....
We use RMA paste and clean with an inline Vigon 200 high pressure machine. Standard ion tests are done regularly, and they show a good and low residue level. However, I have sometimes been wondering what's between the legs. Or balls.
The expected life is 20-30 years for some products, so much can happen under those superBGAs with that time scale, even from small contamination levels.
Anyone who has experience from examining hidden residues?
Winter is nearing...was outdoors yesterday taking pics of the autumn spectra, guess much of northern states are glowing yellow-orange now.
Ingemar Hernefjord
Ericsson Microwave Systems
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of
[log in to unmask]
Sent: den 8 oktober 2004 14:50
To: [log in to unmask]
Subject: [TN] Soldering .8mm BGAs
Hello Technetters:
Processing a 16"x20", .125" thick double-side mixed-tech (smt both sides,
and pth component side) with at least two .8mm BGAs with .45mm balls:
one is a 84 pin package is a 9 x 15 - 135 - ball matrix with 51
depopulated balls in the center of the package
the other is a 8 x 12 - 96 ball - matrix with 8 depopulated balls - 4 at
either end of the matrix
Two quick questions:
Can I clean (in-line) using di water only if I use OA flux? Or, do I need
to switch to no-clean for BGAs less than 1mm?
For rework, flux only? Or can I micro-stencil or dispense?
As always, thanks in advance for your replies,
Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
500 Riverpark Drive
Mail Stop NR500 1-1
North Reading, MA 01864
Tel: 978-370-1726
Pager: 888-561-6485
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