Just a question for interest sake.  Are there any general correlations
between package size, and lead numbers, and moisture sensitivity that can be
made?
For instance, do you think a 17.5mm square 44 lead 4.5mm thick package would
have less or more moisture sensitivity than a 16mm square 64 lead  1 mm
thick package.  The IC's have different functions.

Gut feeling, I think the 64 lead would have more sensitivity.  It is
smaller, with more and finer pitch outside connections.  As dimensions get
smaller, I think the danger of moisture doing damage goes up.  Also, since
there are more leads I feel that there are more locations that possibly
moisture could get in, as the potential for seal breaks is probably greater
at interfaces between plastic and metal?

Am I out to lunch in my general reasoning?

Just thought I would spice up Friday.

To all those Canadians out there, enjoy your turkey and pumpkin pie this
weekend.

Genny Gibbard (mailto:[log in to unmask])

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