Bonjour Yannik,

I suggest you start by checking Daan's http:\\www.smtinfo.net, as there are
some pretty neat articles there. And then, I assume you have serious reasons
for not using pallets. With ICs going to wave, even if they are SOICs, any
variance in the process would create solder bridges.

Regards,
Ioan

> -----Original Message-----
> From: Yannick Brisson [SMTP:[log in to unmask]]
> Sent: Friday, October 08, 2004 10:46 AM
> To:   [log in to unmask]
> Subject:      [TN] Glue printing
>
> Hi,
>
>         We need to produce a large quantite of board double side.  We are
> thinking about glueing one side.  On this side there are some SOIC 14pins,
> 0805, 1206, and a aluminum capacitor case D, I'm wondering if someone
> could
> give me some hint on what to do with the stencil.  The guys is suggest to
> use .006" thick, and the aperture of 33% of the gap and 110% of the width
> on
> the passive component but we don't know about the SOIC and the aluminum
> capacitor.  I don't know if there is anyway to know the amount of glue
> left
> on the board, for the SOIC I know someone who try to glue the component
> with
> a stencil but he said that he need to put manually more glue cause the IC
> fall in the wave.  I don't want to do that.
>
> Thank You
>
> Yannick
>
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