Hi Yannick

I suggest a glue reservoir stencil.  With this approach you can deposit via stencil printing 6 mils of glue for the chip components and up to 40 mil for the SOIC's depending on how much the stand off of the SOIC.  I can send you a copy of a paper on this stenciling process. Or you can go the web www.photostencil.com Click Technical Support  then click Technical Papers then click "Metal Stencils for Adhesive Printing".

Regards,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Yannick Brisson
Sent: Friday, October 08, 2004 8:46 AM
To: [log in to unmask]
Subject: [TN] Glue printing


Hi,

        We need to produce a large quantite of board double side.  We are
thinking about glueing one side.  On this side there are some SOIC 14pins,
0805, 1206, and a aluminum capacitor case D, I'm wondering if someone could
give me some hint on what to do with the stencil.  The guys is suggest to
use .006" thick, and the aperture of 33% of the gap and 110% of the width on
the passive component but we don't know about the SOIC and the aluminum
capacitor.  I don't know if there is anyway to know the amount of glue left
on the board, for the SOIC I know someone who try to glue the component with
a stencil but he said that he need to put manually more glue cause the IC
fall in the wave.  I don't want to do that.

Thank You

Yannick

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