Or trapped by conformal coating


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bruce, Joe
Sent: Friday, October 08, 2004 11:55 AM
To: [log in to unmask]
Subject: Re: [TN] Solder balls acceptance criteria


Hi Group,
Solder balls that are smaller than 0.13 mm (0.005 inch) and less than 5 per
600 mm squared (0.93 sq inch) are process indicators.  If greater than 0.13
mm and not entrapped then it would be a defect.  By entrap it usually means
solder balls are trapped in no clean flux or in adhesives of some sort or
tacked on to a conductor but not creating a clearance violation.

  Joe Bruce
  Functional Excellence
  Solectron - Winnipeg
  204 631-7233

Confidentiality Notice: This e-mail message, including any attachments, is
for the sole use of the intended recipient(s) and may contain confidential
and privileged information. Any unauthorized; review, use, disclosure or
distribution is prohibited. If you are not the intended recipient, please
contact the sender by reply e-mail and destroy all copies of the original
message.



-----Original Message-----
From: Tom Moore [mailto:[log in to unmask]]
Sent: Friday, October 08, 2004 9:36 AM
To: [log in to unmask]
Subject: [TN] Solder balls acceptance criteria


Dear Group,
I'm asking the group again to impart your communal wisdom in interpreting
IPC-A-610. We are seeing solder balls on our SMT assemblies after they have
gone thru board wash (dishwasher). Would these be classified as
entrapped/encapsulated and therefore process indicators and not subject
to "rework" (as long as they don't violate minimum electrical clearance)?
Thanks.

Tom Moore

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------