Hilbrand,
what impressive a site you have found! A good start. I will spread that here to people with Steve's NC machine mentality. Seems as we (Steve and I) speak same language, i.e. a wire bonder is not a 'machine' to me but a 'instrument'. Well, a 250 um aluminium heavy wire manual bonder may not need 1000 class placement, but a 10um gold automatic wedge bonder is something else, believe me!  You may even need vibration absorbers to reduce vibs from heavy machines, elevators etc. So, to say something that make sence, read your presumptive machine's spec carefully and let the bondmachine maker give their oftenly very useful opinion. I can give you one example on misplacement. We performed audit once, and looked among other things on the wire bonder status. We found a machine covered with dust, when you stroke your index finger cross the glass plates that regulates the wire feed, they too were dusty. That told us not to use that supplier...So, listen to Steven..if you spend some mone!
 y on a correct environment for the instrument, it will pay back!

Good Luck

Ingemar Hernefjord
Ericsson Microwave Systems


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of H. Molema
Sent: den 4 oktober 2004 11:00
To: [log in to unmask]
Subject: [TN] Wire bonding equipment


Hi,

I am looking for information about the equipment and the surroundings "clean room?" that you need for wire bonding on a pcb.
Are there people on the Tech-net who are willing to share their experience with wire bonding.
I did find a link that was very useful for general information http://extra.ivf.se/ngl/A-WireBonding/ChapterA.htm

Thanks,

Hilbrand.

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