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October 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 1 Oct 2004 09:30:05 -0400
Content-Type:
text/plain
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text/plain (66 lines)
We have done for assemblers by using castellation vias to make the
connections.  A common method to apply heat sinks some years back was to
use solder to attach to the PCB plane.



Jeffrey Bush
Director, Quality Assurance and Technical Support

                          76 Technology Drive - POB 1890
                             Brattleboro, Vermont 05302-1890
                                Tel. 802.257.4571.21 Fax. 802.257.0011
                                    [log in to unmask]
                              http://www.vtcircuits.com	



-----Original Message-----
From: Phil Nutting [mailto:[log in to unmask]] 
Sent: Friday, October 01, 2004 9:24 AM
To: [log in to unmask]
Subject: [TN] stacking PC boards and reflowing together


Good morning,

Has anyone tried reflow soldering one circuit board on top of another as
if the top board were just another SMT part?

We have a design where we currently design this as thru-hole boards and
attempt to solder them together... sometimes three boards high, which
never works to my satisfaction.

Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
voice 978-922-9300, ext. 2315
fax 978-977-3018
e-mail [log in to unmask]
www.kaisersystems.com

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