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October 2004

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Mon, 4 Oct 2004 12:21:56 +0100
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IS this the same questions as we had recently? 
IF the FeNiCr has been directly electroplated with a fusible (Sn Sn/Pb etc)
or a soluble (Au Ag) coating then the solder will either melt or dissolve
the coating and try to wet to the FeNiCr. And almost certainly fail. You may
achieve some low strength adhesion from mechanically keying, but essentially
expect non wetting. Components will probably fall off if you rap end of PCB
on to desk.

IF the Sn Sn/Pb etc coating has been applied by hot dipping using an
aggressive flux so that a true solder bond (intermetallic) has been formed
then should be no problems. Wetting will already have been achieved and you
will be in exact same position as with any other reflow.
I suppose the worst situation is where the components have been processed in
this way, but marginally/poorly; this will give dewetting, which may be
variable and intermittent.


Regards

Mike


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Friday, October 01, 2004 9:19 PM
To: [log in to unmask]
Subject: [TN] DIP Lead Frame Base material Fe Ni Cr


Fellow TechNetters,

   Can someone share their experience using an Fe Ni Cr lead frame base
metal? This base material is used without a nickel barrier alloy prior
to lead plating. What type of failures could be expected?

Victor,

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