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October 2004

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charles Caswell <[log in to unmask]>
Date:
Wed, 27 Oct 2004 07:27:16 -0500
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Smaller mesh does not mean better release.  The flux component will affect
release much more. Paste manuf. Like to tell you how good they are but it
doesn't alwyways work the way they say.

-----Original Message-----
From: Jason Gregory [mailto:[log in to unmask]]
Sent: Tuesday, October 26, 2004 2:45 PM
To: [log in to unmask]
Subject: ****SPAM**** [TN] Question about 2% Ag and stencil release

Has anybody had any experience or seen/written studies involving 2% Ag
release from stencil apertures? We have a stencil, parts are small resnets,
about 15 mil pitch on a .006" thick stencil. Tried 2% silver paste (for
tombstoning of other parts) with type 5 powder and had major release
problems. We kept the same parameters on the screen printer (for
reference/control purposes) and swapped in our "normal" 63/37 Type 3 powder
and release issues "virtually" went away. Not all the way, but for the most
part. I thought smaller mesh should have meant better release. Solder
gurus ------- enlighten me!

Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)310-7588 cell
[log in to unmask]

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