We have several customers doing this and similar.
For smaller boards these are most often treated as if a BGA.
Other methods include
- to process side by side using a flex ribbon or wires and fold the board on
top after.
- using pins [through hole in at least one board to give location. The
through pins are either wave soldered, or reflowed with washer/rectangle
preforms to give reinforcement to the paste. The preforms are ribbon or
magazine packed so they can be P&P to paste like a regular component.
Some are hybridised so a couple of pins are used as location for the "bga"
board, I suppose it all depends on your approach to the problem - what ever
floats your boat as they say!
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
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Pb-free: www.Pb-Free.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: Friday, October 01, 2004 2:24 PM
To: [log in to unmask]
Subject: [TN] stacking PC boards and reflowing together
Good morning,
Has anyone tried reflow soldering one circuit board on top of another as if
the top board were just another SMT part?
We have a design where we currently design this as thru-hole boards and
attempt to solder them together... sometimes three boards high, which never
works to my satisfaction.
Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
voice 978-922-9300, ext. 2315
fax 978-977-3018
e-mail [log in to unmask]
www.kaisersystems.com
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