Hi Blair,
in tin lead soldering technology, for over a decade we have been soldering
active and passive components with pure tin plated leads/terminations. No
problems with that so far. There are other lead free finishes such as flash
gold, palladium, or palladium/gold over nickel diffusion barrier, which are
successfully processed in either tin-lead or lead free soldering. The only
item you have to pay special attention to are solder balls, where the best
recommendation is to match ball and solder alloy. Make sure that in any case
you get complete fusing of the balls (unless you use high melting balls) of
any BGA, CSP or BGA connector. Each component manufacturer supplies you with
his process recommendations, which are a good start.
Regards
Thomas Ahrens, Boostedt
e-mail [log in to unmask]
----- Original Message -----
From: "Blair K. Hogg" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 26, 2004 9:34 PM
Subject: [LF] Mixed Technologies - Solder and Lead Finish
Greetings LF Forum,
I'm confused (again), but that's not unusual.
I seem to remember a thread a while back (checked the archives - found a
post by David Suraski on 5/31/2001) that indicated that use of components
with a lead finish containing lead would harm the reliability of solder
joints of lead free solder. It was my understanding from this that the small
amounts of lead from the lead finish dissolving into the LF solder joint
caused the solder joint to be unreliable. However, more recent posts
indicated otherwise.
I also remember somewhat recently that someone stated that use of lead-free
component lead finishes in a tin-lead process can cause problems, since the
lead-free finishes won't wet as well with tin-lead process parameters (lower
reflow temperatures).
Has anyone had experience mixing lead-free and tin-lead that can comment on
this?
Thanks,
Blair Hogg
QA Manager
GAI-Tronics Corporation
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