Hi to all!

I am a PCB layout Engineer and been doing some reading/research for our Lead Free assembly that includes the PCB, reflow and wave soldering considerations, components to use and other Lead-free inputs applicable to attain our Lead-free assembly. We manufacture Digital Enhanced Cordless Phones. Our PCBs are normally 1.0mm thickness, FR4 (double sided) and sizes ranges from 70mm x 80mm and above.

My questions are:
1. What can you recommend as the better PCB finish (plating) for such board (DECT)?
2. Can a  FR4 with a Tg of 135ºC withstand the temperature required for Lead-free and so with our PCB thickness?
3. Is a SnAgCu solder alloy best suited for such board? 
4. Is it true that the assembly for lead-free must have separated assembly area to that of the leaded assembly since contamination can occur?
5. Please provide me any information that are vital for our cross over to Lead-free environment?

Your inputs are highly acknowledged. Thank you!  

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