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Final Report: Advanced Embedded Passives Technology



The NCMS ?AEPT Consortium has developed the ideal model for combining

materials, design and processing technologies for embedding passive

devices (capacitors and resistors) into large format circuit board

substrates. These advanced embedded passives technologies will enable

microelectronics manufacturers to economically attain significant

performance improvements, reductions in space requirements, and

reliability improvement in circuit boards. The breakthrough findings are

the result of a collaborative research project spearheaded by NCMS and

co-funded by the industry partners along with National Institute of

Standards and Technology, Advanced Technology Program (NIST ATP).



The scope of the AEPT Program focused on developing the materials,

design, and processing technology for embedding passive devices into

circuit board substrates. Current passive device technology supports a

signal of 1 GHz. This program targeted frequencies of 1-10 GHz by using

embedded passives to maintain signal integrity, enabling significant

improvement in data transmission rates. Key innovations include new

materials that better fit the application domain along with the process

and design accommodations needed to use these materials.



The 329-page final report presents the newly developed materials,

design, and processing technology for embedding passive devices into

circuit board substrates. The document includes many charts, tables, and

photographs, many in color. ?This report is available for delivery

October 1, 2004.



Order Form (PDF) <http://10.1.1.85/AEPTordform.pdf>



For more information please contact: ?Customer Care Manager, Cindi

Bousley, (734) 995-3075, [log in to unmask]