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Date: | Mon, 4 Oct 2004 16:38:41 -0500 |
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----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 09/20/04 08:09 AM
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Final Report: Advanced Embedded Passives Technology
The NCMS ?AEPT Consortium has developed the ideal model for combining
materials, design and processing technologies for embedding passive
devices (capacitors and resistors) into large format circuit board
substrates. These advanced embedded passives technologies will enable
microelectronics manufacturers to economically attain significant
performance improvements, reductions in space requirements, and
reliability improvement in circuit boards. The breakthrough findings are
the result of a collaborative research project spearheaded by NCMS and
co-funded by the industry partners along with National Institute of
Standards and Technology, Advanced Technology Program (NIST ATP).
The scope of the AEPT Program focused on developing the materials,
design, and processing technology for embedding passive devices into
circuit board substrates. Current passive device technology supports a
signal of 1 GHz. This program targeted frequencies of 1-10 GHz by using
embedded passives to maintain signal integrity, enabling significant
improvement in data transmission rates. Key innovations include new
materials that better fit the application domain along with the process
and design accommodations needed to use these materials.
The 329-page final report presents the newly developed materials,
design, and processing technology for embedding passive devices into
circuit board substrates. The document includes many charts, tables, and
photographs, many in color. ?This report is available for delivery
October 1, 2004.
Order Form (PDF) <http://10.1.1.85/AEPTordform.pdf>
For more information please contact: ?Customer Care Manager, Cindi
Bousley, (734) 995-3075, [log in to unmask]
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