John,
Sorry but I am traveling and will not be available....
Cheers,
Dennis DeBord
Advance Technology Advisor
Nortel Networks
13000 Bellford Ct.
Raleigh, NC 27614
Phone: 919-870-6804 (ESN 455)
Cell: 919-523-7399
E-mail: [log in to unmask]
-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Tuesday, October 12, 2004 10:48 AM
To: [log in to unmask]
Subject: [EM] IPC Embedded Passives Design TG Teleconference - October 14
Colleagues,
IPC will host a teleconference for the D-37A Embedded Passives Design Task
Group this Thursday, October 14 2004 at 2PM Eastern, 11AM Pacific. Listed
below (and also attached) is the meeting agenda.
An updated draft copy of the IPC-2316 design guide is available through the
D-37a task group web page located at:
http://www.ipc.org/committeedetail.asp?Committee=D-37A
Dial-in number for the conference call is 1-620-584-8200 and the passcode is
3366#
Regards,
John Perry
Technical Project Manager
IPC
3000 Lakeside Drive # 309S
Bannockburn, IL 60015
[log in to unmask]
1-847-597-2818 (P)
1-847-615-7105 (F)
1-847-615-7100 (Main)
Get Ready to Work at IPCWorks 2004 - www.ipc.org/IPCWorks2004
Embeded Passives Interim Mtgs -- IPC Meeting Agenda - October 14th, 2004
- Review Updates to IPC-2316 Guidelines Document
o Expanded Section 3, Applicable IPC Standards and Guidelines, to
include the same information as in IPC-4811.
o Because section 5 was getting unmanageable in size, we
reorganized the Section 5 (previously "Product Types") into three separate
sections: Resistors, Capacitors, and Inductors. Consolidate some of the
terms and definitions (from Section 2) into these product types sections.
o To address Joel Pieffer's concern that we were putting too much
product and material specific information into the guidelines (particularly,
the former section 5, "Product Types"), we began an editing process to make
the information more generic. This process needs to be done for the
Capacitors section.
o Replaced original UL content from the Guidelines with modified
content from Jack Bramel and Crystal Vanderpan.
o Updated the Cost Model per review from contributors Chet Palesko
and Peter Sandborn.
o Incorporated Duane Delfossee's overheads (Everett Charles) into
the guidelines.
o Discussed the possibility of referencing another document for
section 2, Terms and Definitions.
- Specific Requests and Issues to Discuss:
o How does this document fit into the hierarchy of the other
Embedded Passives Guidelines and Specifications that are currently under
development? Can we refer to a higher level document for terms and
definitions or referenced documents?
o IPC Standards meeting has moved from Monday to Wednesday morning
at IPC Works. Confirm latest version of Guidelines by Oct 18th.
- Action Items Remaining:
o Dave Sawaska (McDermid) agreed to review and provide guidance
for shaping Resistor Materials, Additive Techniques, Thin Film; this section
currently contains the McDermid M-Pass paper.
o Dr. Rob Crosswell from Motorola agreed to provide information
for the thick film section (AI from May 4th meeting)
o Mike Fitts (Mentor) will provide input for the design and CAD
software tools section.
o Jeff Miller (WISE Software ) will provide input for the design
and CAM software tools section.
o Prof. Richard Ulrich agreed to provide design information on
distributed capacitor guidelines. (AI from May 4th meeting)
o Joel Pieffer and Dr. Dave McGregor will provide guidance as to
how the capacitors section should be laid out. (AI from April 12, 2004
meeting).
o Richard Snogren will provide guidance on Thermal Management as
related to Ceramic Thick Film materials. . (AI from April 12, 2004
meeting)
o Karen will incorporate Prof Richard Ulrich's thermal article
into the Thermal Management Issues section, when it is done. We need to
address the empty sections on thermal dissipation and management.
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