Colleagues,

 

IPC will host a teleconference for the D-37A Embedded Passives Design
Task Group this Thursday, October 14 2004 at 2PM Eastern, 11AM Pacific.
Listed below (and also attached) is the meeting agenda.

 

An updated draft copy of the IPC-2316 design guide is available through
the D-37a task group web page located at:

 

http://www.ipc.org/committeedetail.asp?Committee=D-37A

 

Dial-in number for the conference call is 1-620-584-8200 and the
passcode is 3366#

 

Regards,

 

John Perry

Technical Project Manager

IPC

3000 Lakeside Drive # 309S

Bannockburn, IL 60015

[log in to unmask]

1-847-597-2818 (P)

1-847-615-7105 (F)

1-847-615-7100 (Main)

Get Ready to Work at IPCWorks 2004 - www.ipc.org/IPCWorks2004

 

Embeded Passives Interim Mtgs -- IPC Meeting Agenda - October 14th, 2004


-         Review Updates to IPC-2316 Guidelines Document

o       Expanded Section 3, Applicable IPC Standards and Guidelines, to
include the same information as in IPC-4811.   

o       Because section 5 was getting unmanageable in size, we
reorganized the Section 5 (previously "Product Types") into three
separate sections:  Resistors, Capacitors, and Inductors.  Consolidate
some of the terms and definitions (from Section 2) into these product
types sections.  

o       To address Joel Pieffer's concern that we were putting too much
product and material specific information into the guidelines
(particularly, the former section 5, "Product Types"), we began an
editing process to make the information more generic.  This process
needs to be done for the Capacitors section.  

o       Replaced original UL content from the Guidelines with modified
content from Jack Bramel and Crystal Vanderpan.  

o       Updated the Cost Model per review from contributors Chet Palesko
and Peter Sandborn.  

o       Incorporated Duane Delfossee's overheads (Everett Charles) into
the guidelines.  

o       Discussed the possibility of referencing another document for
section 2, Terms and Definitions.  

 

-         Specific Requests and Issues to Discuss:  

o       How does this document fit into the hierarchy of the other
Embedded Passives Guidelines and Specifications that are currently under
development?  Can we refer to a higher level document for terms and
definitions or referenced documents?

o       IPC Standards meeting has moved from Monday to Wednesday morning
at IPC Works.  Confirm latest version of Guidelines by Oct 18th.  

 

-         Action Items Remaining:  

o       Dave Sawaska (McDermid) agreed to review and provide guidance
for shaping Resistor Materials, Additive Techniques, Thin Film; this
section currently contains the McDermid M-Pass paper.

o       Dr. Rob Crosswell from Motorola agreed to provide information
for the thick film section (AI from May 4th meeting)

o       Mike Fitts (Mentor) will provide input for the design and CAD
software tools section.  

o       Jeff Miller (WISE Software ) will provide input for the design
and CAM software tools section.

o       Prof. Richard Ulrich agreed to provide design information on
distributed capacitor guidelines.  (AI from May 4th meeting)

o       Joel Pieffer and Dr. Dave McGregor will provide guidance as to
how the capacitors section should be laid out. (AI from April 12, 2004
meeting).  

o       Richard Snogren will provide guidance on Thermal Management as
related to Ceramic Thick Film materials.  . (AI from April 12, 2004
meeting)

o       Karen will incorporate Prof Richard Ulrich's thermal article
into the Thermal Management Issues section, when it is done.  We need to
address the empty sections on thermal dissipation and management.