Hi Technet,
I'm seeing more and more QFP's and other IC's with a solderable area
underneath the package body (heatsink function). Strangely enough not
much thought is being given to expectations of designers or to the
problems that these components may give in assembly.
Does anyone know of standard requirements (i.e. IPC) for the soldered
area? When a designer doesn't mention it on the assembly drawing,
would you assume that is still mandatory to have solder in that area? If
so, how can this requirement be met when using a soldering iron (i.e.
Metcal's minihoof tip) to install a QFP for rework or repair?
Any other comments with regards to such components?
Best regards,
Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems
Tel +31(0)35 524 8297
Fax +31(0)35 524 8181
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