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October 2004

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Tue, 26 Oct 2004 10:32:34 +0300
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The important thing is to ensure that all incoming boards and components
are sufficiently contamination-free and that your assembly processes do
not add any contamination. This includes such things as air used to foam
or spray the flux, if wave soldering. Under these conditions, provided
you have carefully qualified the deliberately added chemicals in terms
of quality and quantity, you should have no problems. There are no real
or accurate ways to determine the post-soldering cleanliness as a
production process, so it is essential to do all the work before the
soldering process on a day-to-day basis.

Brian

Ted Kong wrote:

> Hi All,
>
> What is the best method to measure the cleaningness of
> a board that use no-clean process?
>
> Thanks all in advance.
>
> Ted Kong
>
>
>
>
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