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Wed, 27 Oct 2004 07:12:19 -0400 |
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Smaller vias produce less inductance making low inductance bypass caps
more effective of low inductance no longer needed. The resin fill is a
normal function of the sub-assembly build up technique for blind vias.
Jeffrey Bush
Director, Quality Assurance and Technical Support
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302-1890
Tel. 802.257.4571.21 Fax. 802.257.0011
[log in to unmask]
http://www.vtcircuits.com
-----Original Message-----
From: Steve Kelly [mailto:[log in to unmask]]
Sent: Tuesday, October 26, 2004 3:22 PM
To: [log in to unmask]
Subject: [TN] Filled vias
Good day to all,
We have a customer who wants us to fill some blind vias with pre-preg.
First I have not heard of a pre-preg fill product. Second the via to be
filled will be .003 - .004 . Third - the customer is under the
impression this will improve electrical performance- is this true? Any
thoughts or help would be appreciated. Thanks in advance. Steve Kelly
PFC Flexible Circuits Limited
Ph: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433
E-Mail: [log in to unmask]
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