Sender: |
|
X-To: |
|
Date: |
Thu, 14 Oct 2004 08:26:39 EDT |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
base64 |
Content-Type: |
text/plain; charset="UTF-8" |
From: |
|
Parts/Attachments: |
|
|
Hi Jean-François,
For understanding, you need to get IPC-SM-785 “Guidelines for Accelerated
Reliability Testing of Surface Mount Solder Attachments.”
For 'Design for Reliability' purposes you need IPC-D-279 “Design Guidelines
for Reliable Surface Mount Technology Printed Board Assemblies.”
For a standard look at IPC-9701 “Performance Test Methods and Qualification
Requirements for Surface Mount Solder Attachments.”
You say:
> And, more precisely, after an assembly
> comes back from the field and has to be retested, are the test performed
> just the same or previous "aging" should be taken in account and how?
> What kind of 'retesting' do you have in mind--and why?
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
|
|
|